shadowjak
12-09-2007, 12:03 PM
Is it worth upgrading now or are you going to see what is coming out in the near future?
How many new technologies do you see being adopted in the next year?
PCI express is evolving-
The first PCI Express External Cabling specifications was released by PCI-SIG February 2007. "This specification helps the industry create new products that will take PCIe technology out of the box – enabling PCIe solutions for IO expansion drawers, external graphics processors, tethered mobile docking, communications equipment and embedded applications".
Standard cables and connectors have been defined for x1, x4, x8, and x16 link widths, with a transfer rate of 250 MB/s. The PCI-SIG also expects the norm will evolve to reach 500 MB/s.The maximal length of cabling isn't known yet.
External PCIe Video Cards could give a notebook the graphic power of a desktop, by connecting a notebook with any PCIe desktop video card enclosed in its own external housing.
As of 2007-09 only one finalized product and two concept products exists. All three delivering the power of the video card to external displays only. And all connecting to a notebook through an ExpressCard interface which limits the bandwidth from an inserted x16 video card (4GB/s in each direction), to just x1 (250MB/s in each direction): Magma ExpressBox ,Luxium by MSI,XG Station by Asus
Just imagine the power of an 8800 on your laptop
Several communications standards have emerged based on high bandwidth serial architectures. These include but are not limited to HyperTransport, InfiniBand, RapidIO, and StarFabric.
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As far as Ram goes welll memory maker Qimonda has begun sampling GDDR 5 video-memory chips, producing what it claimed today was the world's first 512Mb part.
The company said it expects to release GDDR 5 products commercially some time in 2008.
Advantages of DDR3 compared to DDR2
Higher bandwidth performance increase
Performance increase at low power
Enhanced low power features
Improved thermal design (cooler)
Disadvantages compared to DDR2
Commonly higher CAS Latency
Generally costs more than equivalent DDR2 memory
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NEHALEM MICROARCHITECTURE
After Penryn and the 45nm Hi-k silicon technology introduction comes Intel's next-generation microarchitecture (Nehalem) slated for initial production in 2008. By continuing to innovate at this rapid cadence, Intel will deliver enormous performance and energy efficiency gains in years to come, adding more performance features and capabilities for new and improved applications. Here are some new initial disclosures around our Nehalem microarchitecture:
* Dynamically scalable for leadership performance on demand with energy efficiency
o Dynamically managed cores, threads, cache, interfaces and power
o Leverages leading 4 instruction issue Intel® Core microarchitecture technology
o Simultaneous multi-threading (similar to Intel Hyper-Threading Technology) returns to enhance performance and energy efficiency
o Innovative new Intel® SSE4 and ATA instruction set architecture additions
o Superior multi-level shared cache leverages Intel® Smart Cache technology
o Leadership system and memory bandwidth
o Performance enhanced dynamic power management
* Design scalable for optimal price/performance/energy efficiency in each market segment
o New system architecture for next-generation Intel processors and platforms
o Scalable performance: 1 to 16+ threads, 1 to 8+ cores, scalable cache sizes
o Scalable and configurable system interconnects and integrated memory controllers
o High performance integrated graphics engine for client
http://www.intel.com/pressroom/archive/releases/Intel_New_Processor_Generations.pdf
So there are a number of new technologies that will be produced in 2008,and a couple that may debut shortly after.And that isnt even taking into account products from competing companies like ATI/AMD
Here are a couple of examples of tech that could change the whole computing world
Actually in June of 1997 the Air force Rome Lab introduced the first tested and working 3d optical drive,It held the complete contents of 300.000 high density floppies and it read and wrote at the speed of light.
http://www.thic.org/pdf/Jan97/jkannppt.afromelab.pdf
http://www.vxm.com/Speed.MassStorage.html
How many new technologies do you see being adopted in the next year?
PCI express is evolving-
The first PCI Express External Cabling specifications was released by PCI-SIG February 2007. "This specification helps the industry create new products that will take PCIe technology out of the box – enabling PCIe solutions for IO expansion drawers, external graphics processors, tethered mobile docking, communications equipment and embedded applications".
Standard cables and connectors have been defined for x1, x4, x8, and x16 link widths, with a transfer rate of 250 MB/s. The PCI-SIG also expects the norm will evolve to reach 500 MB/s.The maximal length of cabling isn't known yet.
External PCIe Video Cards could give a notebook the graphic power of a desktop, by connecting a notebook with any PCIe desktop video card enclosed in its own external housing.
As of 2007-09 only one finalized product and two concept products exists. All three delivering the power of the video card to external displays only. And all connecting to a notebook through an ExpressCard interface which limits the bandwidth from an inserted x16 video card (4GB/s in each direction), to just x1 (250MB/s in each direction): Magma ExpressBox ,Luxium by MSI,XG Station by Asus
Just imagine the power of an 8800 on your laptop
Several communications standards have emerged based on high bandwidth serial architectures. These include but are not limited to HyperTransport, InfiniBand, RapidIO, and StarFabric.
-----------------------------------------------------------------
As far as Ram goes welll memory maker Qimonda has begun sampling GDDR 5 video-memory chips, producing what it claimed today was the world's first 512Mb part.
The company said it expects to release GDDR 5 products commercially some time in 2008.
Advantages of DDR3 compared to DDR2
Higher bandwidth performance increase
Performance increase at low power
Enhanced low power features
Improved thermal design (cooler)
Disadvantages compared to DDR2
Commonly higher CAS Latency
Generally costs more than equivalent DDR2 memory
-----------------------------------------------------------------
NEHALEM MICROARCHITECTURE
After Penryn and the 45nm Hi-k silicon technology introduction comes Intel's next-generation microarchitecture (Nehalem) slated for initial production in 2008. By continuing to innovate at this rapid cadence, Intel will deliver enormous performance and energy efficiency gains in years to come, adding more performance features and capabilities for new and improved applications. Here are some new initial disclosures around our Nehalem microarchitecture:
* Dynamically scalable for leadership performance on demand with energy efficiency
o Dynamically managed cores, threads, cache, interfaces and power
o Leverages leading 4 instruction issue Intel® Core microarchitecture technology
o Simultaneous multi-threading (similar to Intel Hyper-Threading Technology) returns to enhance performance and energy efficiency
o Innovative new Intel® SSE4 and ATA instruction set architecture additions
o Superior multi-level shared cache leverages Intel® Smart Cache technology
o Leadership system and memory bandwidth
o Performance enhanced dynamic power management
* Design scalable for optimal price/performance/energy efficiency in each market segment
o New system architecture for next-generation Intel processors and platforms
o Scalable performance: 1 to 16+ threads, 1 to 8+ cores, scalable cache sizes
o Scalable and configurable system interconnects and integrated memory controllers
o High performance integrated graphics engine for client
http://www.intel.com/pressroom/archive/releases/Intel_New_Processor_Generations.pdf
So there are a number of new technologies that will be produced in 2008,and a couple that may debut shortly after.And that isnt even taking into account products from competing companies like ATI/AMD
Here are a couple of examples of tech that could change the whole computing world
Actually in June of 1997 the Air force Rome Lab introduced the first tested and working 3d optical drive,It held the complete contents of 300.000 high density floppies and it read and wrote at the speed of light.
http://www.thic.org/pdf/Jan97/jkannppt.afromelab.pdf
http://www.vxm.com/Speed.MassStorage.html